CMP Process Development Engineer (50076)

HEADWAY TECHNOLOGIES INCMilpitas, CA
$95,000 - $150,000Onsite

About The Position

Under the direction of the Sr. Manager of CMP Process Development, the CMP Process Development Engineer is responsible for developing and delivering strategies for improving and optimizing wafer CMP and post-CMP cleaning processes and procedures; designing and conducting routine wafer experiments, analyzing the data, and reporting the results; developing and implementing practices or methodologies which reduce cost and improve operational efficiency; conducting root cause analysis and implementing corrective action; developing and implementing procedures for transitioning new products into the production line; and reviewing, updating, and maintaining documentation and process instructions. This position is located in Milpitas, California.

Requirements

  • Master’s degree in Chemical or Electrical Engineering, Materials Science, or Physics, and/or equivalent relevant experience; PhD degree preferred.
  • Three years of experience with a Master's degree or one year of experience with a PhD working in the magnetic recording head, hard disk drive, or semiconductor industry in a CMP or process engineering role.
  • Solid understanding of semiconductor processing, material science, and chemical-mechanical interactions.
  • Experience with design of experiment techniques (DOE), SPC, defect analysis, and data analysis.
  • Experience with CMP equipment (e.g., Applied Materials, Ebara), metrology tools, and data analysis software (e.g., JMP, SQL).
  • Knowledge of CMP manufacturing processes, practices, and techniques
  • Knowledge of wafer fabrication processing techniques and tools
  • Knowledge of various metrology and optical inspection tools and techniques
  • Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations
  • Able to design experiments, analyze results, and recommend corrective action in order to reduce scrap and improve yield
  • Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management
  • Able to work productively and collaboratively with all levels of employees and management
  • Able to comply with all safety policies and procedures
  • Demonstrated organizational and time management skills
  • Demonstrated problem-solving and trouble shooting skills
  • Flexible and able to prioritize

Nice To Haves

  • PhD degree preferred.

Responsibilities

  • Develops and delivers strategies for improving and optimizing wafer CMP and post-CMP cleaning processes and procedures
  • Develops and implements practices or methodologies which reduce cost and improve operational efficiency
  • Conducts root cause analysis and implements corrective action if required
  • Develops and implements processes or procedures for transitioning new products into the production line
  • Resolves process or metrology issues related to material selection; recommends corrective action
  • Reviews, updates, and maintains documentation and process instructions
  • Instructs operators and technicians on processes and procedures, including modifications to existing procedures
  • Partners with equipment and maintenance personnel in order to minimize tool down time and integrate new tools into the production line
  • Designs and conducts routine experiments, analyzes data, and develops recommendations for improving the performance or reducing cost based on test results
  • Partners with other groups and departments, including process and product engineering to develop and implement new processes which reduce scrap and improve yield
  • Responds to inquiries from other team members, managers, or departments
  • Adheres to all safety policies and procedures as required
  • Performs other duties of a similar nature or level
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