CAD Component Specialist

Qualcomm•San Diego, CA

1d•$62 - $93

About The Position

Qualcomm is a company of inventors that unlocked 5G & 6G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 6Gs potential into world-changing technologies and products. This is the Invention Age - and this is where you come in. The successful candidate will operate as a member of the Central Hardware Systems CAD layout department, and will be able to design and document printed circuit board layouts that conform to manufacturing and industry standards and Qualcomm design guidelines. You’ll collaborate with electrical and mechanical engineering teams to elevate schematics and constraints into high-quality PCB layouts for advanced layout designs across Server, 6G and compute platforms.

Requirements

Associates degree in a technical discipline, Electronics preferred
5+ years actively involved in PCB high speed design.
5+ years actively involved in PCB design for HDI & high-density electronics packaging.
2+ years experience in a PCB design role designing consumer-grade products or low volume test products utilizing latest generation processor chips & ICs.
Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools.
Proficiency on Siemens/Mentor Xpedition, or Cadence Allegro PCB design software
Experience in developing PCB design solutions for a variety of design types and working with internal teams and external suppliers to support PCB fabrication and assembly

Nice To Haves

Design experience: RF, Analog, High-speed digital circuits – DDR5 & 6, HDMI, PCIe, SATA, MIPI, USB 2,3.x, GigE, LPDDR breakouts, complex stackups.
Expected to possess expert understanding and demonstrated application of PCB design principles, practices, and standards.
Able to perform complex and difficult PCB design tasks requiring extensive skill and knowledge of fabrication and assembly process capabilities and limitations.
Develops solutions to a variety of complex problems and proposes PCB design trade-offs to the engineering design team for resolution and implementation.
Determine PCB design trade-offs necessary to meet design requirements and produce high quality cost effective PCB’s that meet schedule objectives.
Understands the requirements driving PCB technology and process trends and their application to Qualcomm designs.
Maintain technical coordination with Engineering and Manufacturing. Resolve PCB design issues with fabrication and assembly vendors.
Participate and provide input into process improvement, PCB and DFM checklists and guidelines.
Participates in determining objectives of assignment and plans, schedules, and arranges own activities in accomplishing objectives.
Experience working with various EMI mitigation techniques and practices.
Experience with IDF/EMN file exchange between mechanical and HW teams.
Understands project goals and individual contribution toward those goals.
Effectively communicates with project peers and engineering personnel via e-mail, web meetings, and instant messaging including status reports and illustrative presentation slides.
Interact and collaborate with HW leads, Engineering team & other internal PCB designers for optimal product development processes and schedule execution.
Effectively multitasks and meets aggressive schedules in a dynamic environment.
Prepare and deliver design reviews to project team.
Possess excellent verbal and written communication skills
Leadership skills to help direct, prioritize, and clearly set project tasks per schedule. Communicate milestones and directions to outside team members.

Responsibilities

Design PCB layouts for reference server and PC compute systems, including form factor accurate (FFA) test platforms and high-volume circuit boards.
Engineer high-speed, multi-layer stack-ups encompassing application processors, digital processors, RF/radio circuits, and power delivery networks.
Utilize advanced manufacturing techniques: stacked micro-vias, sequential lamination, and small-pitch package design rules.
Collaborate effectively with internal teams in the U.S. and design partners in India to deliver high-performance PWB solutions.
Liaise with internal stakeholders and external vendors to support PCB fabrication and assembly throughout the product lifecycle.

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