Baseband Sr. Engineer

Qualcomm•San Diego, CA

About The Position

We are seeking a highly motivated Baseband (BB) Engineer to join our Telematics Hardware Platform Systems team. In this role, you will be responsible for the design, integration, bring‑up, and validation of baseband subsystems for automotive‑grade telematics platforms(TDP, QMP, DC). You will work closely with RF, systems, software, component, and customer engineering teams to deliver robust, production‑ready hardware solutions that meet performance, reliability, and quality requirements. The ideal candidate has strong fundamentals in digital hardware systems, hands‑on experience with baseband brings‑up and debugging, and a passion for solving complex system‑level problems in a fast‑paced, cross‑functional environment. This role provides the opportunity to contribute directly to next‑generation automotive telematics platforms from early concept through mass production.

Requirements

Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.
OR
Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience.
OR
PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.

Nice To Haves

Master’s degree in electrical engineering, Computer Engineering, or a related field.
Experience with automotive or telematics platforms, including modem‑based SoCs and system‑level hardware integration.
Hands‑on experience with baseband bring‑up, debug, and validation on new hardware platforms.
Strong understanding of digital hardware systems, including memory interfaces (e.g., DDR), high‑speed digital buses, and power sequencing.
Familiarity with HW/SW interaction and ability to collaborate closely with firmware, driver, and systems teams during platform bring‑up.
Experience debugging system issues using lab equipment such as oscilloscopes, logic analyzers, spectrum/network analyzers, and protocol analyzers.
Knowledge of signal integrity (SI) and power integrity (PI) concepts and ability to identify system‑level electrical issues.
Experience working with cross‑functional teams (RF, systems, software, mechanical, component engineering, and customer engineering) to deliver end‑to‑end hardware solutions.
Exposure to automotive quality and reliability requirements (AEC, temperature, lifecycle considerations) is a plus.
Strong communication skills with the ability to clearly document issues, analysis, and solutions.

Responsibilities

Participate in the design, integration, and bring‑up of baseband subsystems for automotive telematics hardware platforms, from early prototypes through production.
Perform system‑level debugging and root‑cause analysis of baseband‑related issues across hardware, firmware, and system interfaces.
Collaborate closely with RF, systems, software, component, mechanical, and customer engineering teams to ensure successful end‑to‑end platform integration and validation.
Support hardware validation, characterization, and issue tracking, including lab bring‑up, stress testing, and performance analysis.
Analyze and review schematics, board designs, and system architecture to identify and mitigate baseband‑related risks.
Work with software and systems teams to support HW/SW co‑debug, including boot issues, power sequencing, memory interfaces, and high‑speed digital connectivity.
Develop and maintain technical documentation, including bring‑up notes, debug reports, and design recommendations.
Support customer and field issues by reproducing problems in the lab, identifying root causes, and driving corrective actions.
Contribute to platform reviews, design discussions, and post‑silicon bring‑up activities to improve robustness, quality, and time‑to‑market.
Adhere to automotive quality, reliability, and compliance requirements throughout the product development lifecycle.