Backend Process Engineer
About The Position
The Backend Process Engineer – InP Wafer Fab position is responsible for development, optimization, and manufacturing support of backend wafer fabrication processes for Indium Phosphide ( InP )–based photonic devices, including DFB lasers, Semiconductor Optical Amplifiers (SOAs), and Gain Chip products. This role provides technical ownership of critical backend modules including wafer lapping/thinning, n-side metallization, rapid thermal annealing (RTA), and automated optical inspection (AOI). The position also supports singulation, optical coatings, reliability readiness, and packaging interfaces, with a strong focus on yield, defect reduction, and manufacturing stability.
Requirements
- Bachelor’s degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related field
- Minimum of 3+ years of experience in backend semiconductor processing
- Hands-on experience with lapping/thinning, metallization, and thermal processes
- U nderstanding of InP -based or III-V compound semiconductor wafer fabrication processes
- Experience with AOI systems, yield analysis, and data-driven process improvement
- Strong understanding of singulation, packaging interfaces, and reliability requirements
- Proficiency in SPC, DOE, and statistical analysis
- Ability to work across cross-functional manufacturing and engineering teams
Nice To Haves
- Preferred experience with InP or III-V optoelectronic devices
- Familiarity with AR/HR optical coating processes
- Experience supporting high-mix, low-volume manufacturing environments preferred
Responsibilities
- Backend Process Ownership and Optimization (35%) : Own and optimize backend wafer fab processes including lapping/thinning, n-side metallization, and RTA
- Establish robust process windows, recipes, and control limits for backend modules
- Maintain stable manufacturing performance through continuous monitoring and improvement
- Yield Improvement, Defect Reduction, and AOI Control (25%) : Own and maintain AOI processes for backend defect detection and yield monitoring
- Drive singulation yield improvement and defect reduction through data analysis and root-cause investigations
- Analyze inline and post-process data to identify trends and systematic issues
- Implement corrective and preventive actions and verify effectiveness
- Singulation, Optical Coatings, and Packaging Interface Support (20%) : Support cleaving, dicing, and singulation processes to ensure device integrity
- Provide process engineering support for AR/HR optical coatings and vendor qualifications
- Collaborate with packaging, device, and reliability teams to ensure packaging readiness
- New Product Introduction and Technology Support (10%) : Support new product introduction (NPI), process transfers, and technology changes
- Evaluate backend process risks associated with new designs , materials, and device structures
- Documentation, Process Control, and Manufacturing Support (10%) Author and maintain SOPs, travelers, process specifications, and control plans
- Define SPC metrics and control strategies for backend processes
- Provide hands-on manufacturing and troubleshooting support as needed
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
Number of Employees
501-1,000 employees
