Automatic/Manual Wire Bonding Operator

MACOM Technology Solutions Holdings, Inc. • Lowell, MA

11d

About The Position

This role will be an assembly operator working with Manual/Automatic wire/ribbon bonding equipment.

Requirements

• Ability to set-up, operate and adjust (Plaomar 8000, H+K 820 systems or F&K Delvotec) or ability to learn to run a variety of microelectronic production equipment.
• Minimum of 2 years' experience in microelectronics module assembly area.
• High School diploma required.
• Gold wire/ribbon bonding to a variety of die and substrates.

Nice To Haves

• Capable of programming equipment helpful

Responsibilities

• Works under direction and from production schedules, manufacturing procedures, process plans and written or oral instruction.
• Operate and set-up Automatic Gold wire/ribbon bonders (Palomar 8000, H+K 820 systems or F&K Delvotec) per micro-circuit layout drawings
• Operator is responsible for proper wire formation, bond appearance and bond strength.
• Flexibility to be trained in multiple Microelectronics processes that involve ball & wedge wire bonding and ribbon bonding
• Capable of performing bond pull, die shear, Dap Cap, Die Attach, Dot Branding and laser branding, and plotting SPC with data
• Familiarity of the use of plasma cleaning and other surface preparation for semiconductors and substrates
• Requires significant attention to detail for production activities and documentation to maintain compliance with MIL-STD 883 requirements
• Familiarity with FOD prevention and management
• Familiar with ESD controls

Benefits

• Health, dental, and vision insurance.
• Employer-sponsored 401(k) plan.
• Paid time off.
• Professional development opportunities.

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level
• Education Level: High school or GED
• Number of Employees: 501-1,000 employees