Auto/Manual Die Attach Operator II (22275)

Neotech Sarl • Los Angeles, CA

207d • $18 - $19

About The Position

The Auto/Manual Die Attach Operator II is responsible for the operation of automatic epoxy dispense, screen printing, and microelectronic component placement equipment in a clean-room environment, to manufacture high-reliability microelectronic devices. The role involves reading and interpreting assembly instructions, setting up and running epoxy dispensing equipment, and pick and place machines, along with some programming tasks. The operator must handle fine-pitched microelectronics components and perform inspections to ensure quality standards are met.

Requirements

• Minimum 1 year working experience as a manual die attach/sub-attach operator in a microelectronic assembly factory.
• Familiarity with MIL-PRF-38534 requirements for microelectronics' assembly.
• Ability to work in a class 100,000 (class 8) clean room environment.
• Ability to work with a 30X microscope throughout the day.
• Ability to work in a manufacturing area with normal factory noise levels.
• Mechanical aptitude/dexterity and the ability to lift up to 20 lbs.
• Fluency in English Language - Reading, written & spoken.

Nice To Haves

• Experience with programming and/or operating Camelot, Asymtek epoxy dispensers, MRSI and Palomar Pick and Place equipment or equivalent.
• Ability to access documents using a computer.
• Sense of urgency and successful at meeting deadlines.
• Should not have a problem using chemical-based cleaning systems for cleaning build substrates.

Responsibilities

• Read and interpret assembly instructions, drawings, and work instruction processes.
• Set up and run epoxy dispensing equipment.
• Set up and run pick and place machines.
• Perform programming as required.
• Handle computers to fine-tune machine programs.
• Conduct written tests for ESD + Manual Die attach and Auto die attach requirements.
• Use tools such as fine tipped tweezers, x-acto knives, vacuum pencils, dental probes, calipers, and scales.
• Handle fine pitched microelectronics components such as dies, air-bridge dies, capacitors, resistors, substrates, hybrids, and epoxy.
• Manually apply epoxy and solder on densely populated substrate pads.
• Perform rework by removing epoxy, die, and other components from substrates.
• Work with sikama reflow equipment and ovens.
• Inspect epoxy placement and microelectronics component assembly for defects.
• Adhere to all ESD and other handling requirements.
• Comply with all in-house training as identified in job specific training plan.
• Follow company 6S and continuous improvement (kaizen) objectives.
• Perform all other duties as assigned.

Benefits

• Comprehensive benefit package including medical, dental and vision coverage.
• Company-paid basic life/AD&D insurance.
• Short-term and long-term disability insurance.
• Voluntary supplemental insurances.
• Flexible spending accounts.
• Employee assistance program (EAP).
• Sick Leave, Vacation Time, and company-paid Holidays.
• 401(k) Retirement Savings Plan option with a company match.

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level
• Industry: Chemical Manufacturing
• Education Level: High school or GED