Associate Engineer, NPI Packaging

Murata America•San Diego, CA

10d

About The Position

pSemi Corporation is a Murata company driving semiconductor integration. pSemi builds on Peregrine Semiconductor’s 30-year legacy of technology advancements and strong IP portfolio but with a new mission—to enhance Murata’s world-class capabilities with high-performance semiconductors. With a strong foundation in RF integration, pSemi’s product portfolio now spans power management, connected sensors, optical transceivers, antenna tuning and RF frontends. These intelligent and efficient semiconductors enable advanced modules for smartphones, base stations, personal computers, electric vehicles, data centers, IoT devices and healthcare. From headquarters in San Diego and offices around the world, pSemi’s team explores new ways to make electronics for the connected world smaller, thinner, faster and better. Job Summary The Associate NPI Packaging Engineer works under the guidance of a senior packaging and assembly engineer to support quick turn prototype assembly to facilitate pSEMI new product development. In addition, this position is responsible supporting implementation trials for SMT assembly processes under guidance, assisting with material tracking and proto-line equipment coordination (scheduling, basic upkeep) with direction from senior engineers and technicians. This position supports critical NPI development activities and requires high attention to detail, self-motivation, precision in task execution, delivering results according to an agreed upon schedule, seeking guidance when requirements are ambiguous and teamwork.

Requirements

0–1 years related experience; internships or co‑ops acceptable.
Ability to coordinate with external suppliers under supervision and track builds/data.
Ability to follow standard procedures and work instructions with high attention to detail.
Effective written and verbal communication; clear documentation skills.
Foundational understanding of IC packaging concepts and basic manufacturing flow.
Proficiency with office tools and willingness to learn CAD/analysis tools quickly.

Responsibilities

Assist in the development and optimization of the prototyping Surface Mount Technology (SMT) line for fully packaged, single die FCLGA, SiP, and PCB assembly.
Coordinate actions with crossfunctional teams (design, assembly, test, reliability) for prototype builds; track lots and materials and provide status updates.
Operation and recipe creation for SMT line equipment and processes in these key process steps.
Paste / flux printers
SMT pick-and-place
Plasma clean
Reflow Ovens
Underfill / dam and fill compound dispensers
Laser Marking equipment
Saw singulation equipment.
Work closely with packaging and assembly teams to support process robustness and manufacturability.
Coordinate and set up of design of experiments (DOE’s) for improved process development.
Equipment process documentation and procedure generation with approval from senior engineers.
Collect data, produce basic analyses and standard reports (yields, voiding, placement accuracy, reflow profiles).
Assist with fixture and jig updates or simple designs under supervision; manage fabrication requests and basic bring up.