Assembly Process Engineer

Precision NeuroscienceSanta Clara, CA
6d$105,000 - $132,000Onsite

About The Position

Precision Neuroscience is building a next-generation brain–computer interface (BCI) to heal and empower millions of people living with neurological conditions. Our first product, Layer 7, is designed to help people with severe paralysis operate digital devices using only their thoughts—opening up new possibilities for daily life. Our team brings together experts in neurosurgery, AI and machine learning, microfabrication, electrical engineering, clinical science, and more. We combine deep technical rigor with a people-first mindset to turn breakthrough research into real-world medical solutions. As a Precision employee, you’ll join one of the fastest-moving and best-capitalized companies in the emerging field of brain–computer interfaces. Since our founding in 2021, we have raised more than $180 million, advanced our technology through validation, and initiated human trials with leading hospitals across the country. Our Values: We build for human impact, measuring progress by the lives our work can change. We do no harm, holding ourselves to the highest standards of safety, integrity, and responsibility. We innovate with urgency, because the stakes are high and our users can’t wait. We bring sharp minds, open ears, pairing expertise with curiosity, humility, and respect. And we lead the way, taking ownership of our work and helping to shape the future of our field. We are seeking an Assembly Process Engineer to execute MEMS assembly and packaging processes for key components of our implantable devices. In this role you will play a key part in developing assembly and packaging techniques for key interfaces of our BCI, leveraging both novel and traditional assembly processes as well as testing and metrology expertise to bring our core components together. This position will be based in our Santa Clara office. We are unable to consider remote workers or individuals who are not currently based in the US and legally authorized to work in the US.

Requirements

  • Bachelor’s degree or above in Electrical Engineering, Mechanical Engineering, Bioengineering, or related discipline.
  • 2+ years’ experience working in similar roles.
  • Experience with MEMS assembly and packaging technologies, including the use of equipment such as flip chip and/or die bonders, screen printing tools, plasma process equipment, and reflow systems.
  • Experienced with basic electrical, mechanical test, microscopy, and other process metrology systems and techniques.

Responsibilities

  • Completes hands-on assembly, integration and testing tasks on the key interfaces between our electrode array and the rest of our BCI.
  • Completes upkeep and maintenance of assembly and packaging tooling, including lab and equipment supply maintenance.
  • Communicates project updates on progress, risks, options, barriers and recommendations to other members of the team.
  • Works with Precision’s Quality and other engineering teams to maintain documentation associated with the product development cycle including risk management and Verification and Validation.
  • Collaborates with the team to publish and present our work.
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