Assembler - Level 3

Honeywell•Lansdale, PA

About The Position

Build Precision. Empower the Mission. — Sr. Microelectronics Assembler -2nd Shift At Honeywell , we don’t just assemble electronics—we craft the building blocks of national defense and aerospace innovation. As a trusted leader in mission-critical systems and electronic warfare solutions, we’re seeking a skilled Microelectronics Assembler to join our Integrated RF Systems (IRFS) Value Stream in the Microwave Department . This is a hands-on role where attention to detail meets advanced technology . You’ll be part of a team that transforms intricate components into high-performance assemblies used in the most demanding environments. At CAES by Honeywell, your craftsmanship supports systems that protect lives and power aerospace missions. Join us and be part of something bigger than yourself. As a Sr. Microelectronics Assembler at CAES by Honeywell Lansdale, you’ll be part of a high-tech team crafting the components that power aerospace and defense systems. Your work demands focus, finesse, and a commitment to excellence.

Requirements

Ability to work 2nd shift (2:30pm to 12:00)
High school diploma or equivalent.
2 year of experience working as an electronic assembler.
2 year of experience wire bonding - thermosonic, thermocompression and ball bonding
Able to interpret and work with print and parts list, process sheets/route cards and technical drawing packages(i.e., ECO’s).
Able to use hand tools.
Able to use measurement tools and devices such as scales, Calibrated eyepieces and caliphers.
This position requires access to technology, materials, software or hardware that is controlled by US export laws. In order to be eligible for this position, you must be a “US Person” under US export laws (or eligible for approval under a U.S. Government export license).
Ability to obtain and maintain a security clearance.
Must be a US Citizen due to contractual requirements

Nice To Haves

4 years of experience working as an electronic assembler
4 years of experience wire bonding - thermosonic, thermocompression and ball bonding
Experience in Automatic wire bonding (gold wire)
Experience in Automatic ball or wedge bonding

Responsibilities

Assemble, modify, rework, and repair electrical components, subassemblies, and moderately complex modules using schematic diagrams, process sheets, and technical drawings
Ensure every build meets exacting standards—performing rework when needed to guarantee quality and reliability
Verify producibility during initial assembly to ensure smooth production flow
Perform tasks from lower-level assembler roles and cross-train across other assembly positions to support team flexibility
Execute manual die-attach using epoxy and solder to place components as small as 10x10 mils —all while working under a microscope
Take on additional duties as needed to meet production goals and support mission-critical timelines