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Cisco Silicon One is a business organization with a long track record of building complex and high-performance Silicon ASICs. Our silicon devices drive the world's most complex networks and carry over 90% of IP traffic. We are a highly specialized ASIC team with experts in all aspects of advanced IC package design and heterogeneous system integration. Our substrates use the latest 2.5D fanout technologies for large-scale integration, using the latest signaling and data transfer technologies. Cisco SiliconOne ASIC team is looking for an expert in Signal and Power Integrity to help us develop our next generation ASIC packaging. You will work on cutting-edge FCBGA substrates that push the boundaries on power, speed, and fabrication / assembly technology. You will drive ASIC package power and signal integrity rules and layout analysis to enable on-time, high-quality manufacturing releases. You will actively implement the latest SERDES speeds and technologies while developing creative solutions for these signaling and power distribution challenges.
