Applications Engineer

Foxconn Interconnect TechnologyBellevue, WA
3d

About The Position

Applications Engineer Collaborate with MicroSoft Product Development Team of next generation Surface and XBOX over the mechanical aspects of new cable and connectors design including completion of DFM (Design for Manufacturing), FEA stress analysis and signal integrity simulation, prototype builds, validation, and PPAP (Production Part Approval Process); Coordinate with cross-functional team and factories to support customers for design change; try out different surface finish to meet ID requirement including PVD, black nickel, electroless plating and sand blasting, etc.

Requirements

  • MSME

Responsibilities

  • Collaborate with MicroSoft Product Development Team of next generation Surface and XBOX over the mechanical aspects of new cable and connectors design
  • Completion of DFM (Design for Manufacturing)
  • FEA stress analysis and signal integrity simulation
  • Prototype builds
  • Validation
  • PPAP (Production Part Approval Process)
  • Coordinate with cross-functional team and factories to support customers for design change
  • Try out different surface finish to meet ID requirement including PVD, black nickel, electroless plating and sand blasting, etc.
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