Advanced Packaging Thermal Engineer

Marvell Technology • Austin, TX

242d • $125,900 - $186,260

About The Position

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. The Marvell Advanced Packaging R&D team is responsible for package design and technology development to meet the electrical, mechanical, thermal and system requirements for the next generation high performance computing (HPC), Artificial Intelligence (AI) and networking solutions. The group focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, processability, manufacturability, and reliability, involving high speed signaling and complex power delivery networks (PDNs) requiring innovative and custom solutions to meet constantly evolving customer needs. Many of the new designs require multi-chip, multiple component configurations involving, but not limited to, 2.5D and 3D packages, Co-packaged copper or optics and advanced substrates.

Requirements

• Experience in advanced package technology with deep understanding of heat transfer, fluid dynamics and material science.
• Experience with creating thermal solutions at the component and system levels.
• Experience in managing vendors, substrate manufacturers, OSATs and foundries.
• Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 5-10 years of related professional experience, OR Master’s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 3-5 years of experience.

Nice To Haves

• Understanding of package, interposer, silicon, substrates and PCB designs.
• Understanding signal integrity and power integrity.
• Experience in packaging for datacenter market segment.

Responsibilities

• Create thermal solutions for datacenter silicon package, create design, develop material and process, and validate solutions at component and system levels.
• Work with external stakeholders to define thermal roadmap.
• Explore technologies beyond what is currently available, make recommendations, and create and protect IP to maximize performance.
• Explore technology feasibility and create proof-of-concept samples.
• Collaborate with IP, Si design, package design, production and test teams.

Benefits

• Flexible time off
• 401k
• Year-end shutdown
• Floating holidays
• Paid time off to volunteer

What This Job Offers

• Career Level: Mid Level
• Education Level: Master's degree
• Number of Employees: 5,001-10,000 employees