Advanced Packaging Technologist

IBM • Albany, NY

386d

About The Position

The Advanced Packaging Technologist at IBM will lead chiplet and advanced packaging initiatives within the Semiconductor division. This role involves working with a team of engineers to develop and innovate advanced packaging technologies, contributing to the future of AI and Quantum Computing. The position requires deep technical knowledge and experience in various advanced packaging methods and collaboration with cross-functional teams.

Requirements

• 10+ years of experience in advanced packaging technology.
• 5+ years of team lead experience.
• 5+ years of experience working with packaging companies and OSATs.
• Proven track record of innovation and technical eminence.

Nice To Haves

• 15+ years of experience in advanced packaging technology.
• 10+ years of team lead experience.
• Prior experience in driving joint development with tooling/material supplier ecosystem.

Responsibilities

• Lead chiplet and advanced packaging initiatives for IBM Semiconductors.
• Manage a team of multi-disciplinary engineers in advanced packaging technology development.
• Collaborate with cross-functional teams on unit process development and materials.
• Drive joint development with tooling and material suppliers.
• Conduct reliability and failure analysis of packaging technologies.

Benefits

• Healthcare benefits including medical & prescription drug coverage, dental, vision, and mental health & well being.
• Financial programs such as 401(k), cash balance pension plan, and life insurance.
• Generous paid time off including holidays, sick time, and vacation.
• Training and educational resources on a personalized learning platform.
• Diverse and inclusive employee resource groups and volunteer opportunities.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Industry: Computer and Electronic Product Manufacturing
• Education Level: No Education Listed