Advanced Packaging SI/PI Staff Engineer

Marvell TechnologyWestborough, MA
74d$106,700 - $157,840

About The Position

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. The Marvell Advanced Packaging team is responsible for supporting customers with package designs that meet challenging electrical requirements. High speed signaling and challenging power delivery networks require complex and custom solutions to meet constantly advancing application needs. Many of the new designs require multi-chip and multiple component configurations with high-speed IP requirements. In addition, our team is advancing Marvell's expertise in 3D packaging, Co-packaged optics and cutting-edge substrate materials. We work with the world's leading manufacturers to solve our client's most challenging designs and integrations with industry-leading packaging techniques.

Requirements

  • Bachelor's degree in electrical engineering or related fields
  • 2+ years of related professional experience in package or PCB design, or master's degree and/or PhD in Electrical Engineering with coursework and experience in signal integrity and power delivery.
  • Knowledge of Electrical Engineering concepts, circuit extractions and simulation, as well as design methodology and strategies.

Nice To Haves

  • Understanding of signal integrity and power integrity concepts and fundamentals
  • Experience with simulation and analysis tools such as Ansys HFSS, Keysight ADS, Cadence Sigrity tools
  • Working knowledge of circuit extractions and simulation techniques
  • Ability to work with engineers in multiple locations and geographies
  • Strong communication, presentation and documentation skills
  • Familiarity with semiconductor packaging technologies, materials, and substrate or PCB design.

Responsibilities

  • SI/PI analysis of designs and optimization within 2D/2.5D/3D packages
  • Interfacing with product design teams for optimized floor-planning, package related design input and power delivery network design
  • Perform wiring studies in order to determine optimal signal routing, power delivery verification and package size determination.

Benefits

  • Flexible time off
  • 401k
  • Year-end shutdown
  • Floating holidays
  • Paid time off to volunteer

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What This Job Offers

Career Level

Entry Level

Education Level

Bachelor's degree

Number of Employees

5,001-10,000 employees

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