Advanced packaging process integration development engineer

GlobalFoundries • Malta, NY

85d • $107,400 - $204,500

About The Position

This advanced packaging process integration development engineering role will lead post Fab process development to meet customer requirements. The candidate will have a strong focus on TSV reveal and RDL plating processes to support silicon photonics and other product lines.

Requirements

• Education - Master's in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
• MS degree with at least 10 years of prior related work experience.
• Must have at least an overall 3.0 GPA and proven good academic standing.
• Language Fluency - English (Written & Verbal).
• Travel - Up to 10%.

Nice To Haves

• Education - PhD education level preferred with at least 8 years of prior related work experience.
• Deep understanding of semiconductor processes, such as Litho, Etch, Cleans, CVD, etc.
• Experience in bringing packaged products from development into production.
• Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
• Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
• Strong written and verbal communication skills.
• Strong planning & organizational skills.

Responsibilities

• Lead wafer level packaging process development efforts and planning by working with the unit process engineers and directly with tools & materials for Advanced Packaging and Photonics Center (APPC) in Malta, NY (Fab 8).
• Drive understanding of failure modes and work with cross functional teams to identify and resolve technical issues.
• Develop integration schemes to continuously improve yields and to reduce cycle-time & costs.
• Generate IP related to novel wafer integration & packaging technology.
• Drive end-to-end process integration and planning to enable new capability planning, early product prototyping and qualification across multiple programs.
• Develop expertise in processes, materials and tooling leveraging available characterization resources.
• Collaborate with OSATs (Outsourced Assembly and Test) to develop new wafer level integration processes.
• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
• Other duties as assigned by manager.

Benefits

• Equal opportunity in the workplace.
• Cultural diversity within the company enhances its business potential.

What This Job Offers

• Job Type: Full-time
• Industry: Computer and Electronic Product Manufacturing
• Education Level: Master's degree