Advanced Packaging Microelectronics Integration Engineer

Skywater•Kissimmee, FL

1d•Onsite

About The Position

We are looking for a hardworking, and passionate experienced Sr. Process Integration and Development Engineer for our Florida Advanced Packaging site. In this role, you will lead, develop, and improve an overall integrated Advanced Packaging process flow to deliver a qualified product to our foundry clients. Excellent oral and written communication skills are required to communicate ideas with foundry customers, colleagues, and management. The role involves transferring client package requests into process flows, identifying development areas, leading process teams, and ensuring high yield and qualifiable final products.

Requirements

BS Engineering
10+ years of Process Development & Integration Engineer experience in Advanced Packaging Fab environment of 10K and 1K clean rooms related to FanOut wafer level assembly.
Advanced Packaging Fab processing tools knowledge/experience
MEMS / Photonic / HPC /AI / ASIC / Quantum device and integration knowledge with relevant combination of years of experience and/or advanced degree.
Knowledge of DOE, SPC, and 6-sigma concepts and applications.
Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes.
Can work both independently and in cross-functional teams for problem solving.
US Citizenship Required
Ability to obtain a US government security clearance.
Excellent oral and written communication skills

Nice To Haves

MS/PhD preferred
Project Management skills and/or defined training a plus

Responsibilities

Transfer a client’s package requests into a process flow that utilizes Si interposer, FanOut and hybrid bonding manufacturing process flows.
Identify areas that require development and lead the process team to deliver on schedule and with high yield a qualifiable final product.
When required, lead task forces to identify root causes, correct and maintain product deliverables.
Gain / utilize knowledge of the capabilities and interdependencies of tool sets within the process flow to create recipes that utilize temporary and permanent bonding, electrolytic / PVD metal deposition, dielectric deposition, photolithography, etch, CMP, bake, reflows, flip chip, wire bond tools.
Process integration for a wide variety of clients that include MEMS / Photonics / High Performance Computing / CMOS / Memory / AI / Quantum devices
Integrate TSV first and / or TSV last process flows to enable Foundry client packages.
Utilize metrology tools to characterize process conditions, identify root cause of any defects and document results.
Investigate and drive integration changes for improved device performance and yield improvement.
Work with process and tool engineers to find processing marginalities and make improvements.
Routinely monitor selected in line and end of line SPC charts for trends or excursions that can be addressed by integration changes.
Utilize data analysis software to drive data driven decisions
Create quick turn cycles of learning to identify issues early and create a final product and process flow for Foundry clients.
Incorporate, monitor and improve electrical test parametrics to deliver an electrically good final package.
Create end-to-end process flows to aid in project scoping
Perform other duties as assigned.