Advanced Packaging Engineer

SkyWater Technology Foundry • Kissimmee, FL

66d

About The Position

We are seeking a highly skilled and motivated Advanced Packaging Engineer with hands-on experience in relevant technologies. The successful candidate will be responsible for the development, optimization, and sustaining of advanced packaging solutions.

Requirements

• At least 5-10 years of hands-on experience in semiconductor packaging process development (e.g., compression mold, ball attach, laser groove, dicing, die attach, tape & reel, backgrinding / thinning).
• Knowledge of JEDEC reliability testing and associated failure modes & remedies.
• Familiarity with materials used in FOWLP/FOPLP ball attach and RDL is an added advantage.
• US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.
• Solid understanding of failure analysis and troubleshooting with 8D, Six sigma processes.
• Strong problem-solving skills and a detail-oriented approach is needed.
• Ability to communicate technical concepts clearly to both technical and non-technical stakeholders.
• Strong teamwork, collaboration, and interpersonal skills is required.
• Ability to work in a fast-paced, cross-functional team environment.
• BS degree in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, or a related field, MS or PhD degree is a plus.

Responsibilities

• Lead process development and optimization of IC packaging processes (e.g., compression mold, ball attach, laser groove, dicing, die attach, tape & reel, backgrinding / thinning).
• Define and execute DOE (Design of Experiments) for new materials and process evaluations.
• Establish process windows and control limits; develop process documentation including FMEA and control plans.
• Support new product introductions and ramp to production by collaborating closely with manufacturing and Product teams.
• Identify root causes and drive corrective actions for yield and reliability issues.
• Troubleshoot process issues, providing continuous improvements to yield, quality, and cycle time.
• Work with tool vendors and material suppliers to develop next generation technologies.
• Maintain clear documentation of process changes, results, and improvements through review & control processes.
• Present findings and suggest improvements to leadership teams.

What This Job Offers

• Industry: Computer and Electronic Product Manufacturing
• Education Level: Bachelor's degree
• Number of Employees: 501-1,000 employees