Advanced Package Design Engineer

SK hynix America•San Jose, CA

7h•$110,000 - $155,000•Onsite

About The Position

We are seeking a skilled Advanced Package Design Engineer to join our Packaging Engineering team in SK Hynix America. You will be responsible for designing and optimizing high-performance, high-density Interposers for chiplet-based architectures and heterogeneous integration solutions. You’ll collaborate closely with PCB, SI/PI, thermal, and manufacturing teams to deliver robust, manufacturable, and cost-effective package solutions

Requirements

Bachelor’s or Master’s degree in Electrical Engineering (Preferred), Mechanical Engineering, Material Science, or a related field.
3+ years of experience in semiconductor package design or layout
Proven experience with layout tools Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition
Understanding of high-speed signal routing, power distribution networks (PDN)
Familiar with 2.5D/3D packaging technologies, substrate design rules, and large body substrate technologies
Effective communication skills and ability to work in a fast-paced, cross-functional environment

Nice To Haves

Currently pursuing a PhD's degree in Electrical Engineering or a related field
5+ years of experiences in advanced packaging layout design
Experience with SI/PI simulation tools (Ansys, HFSS, ADS)
Proven understanding of high-speed signal routing, power distribution networks (PDN)
Proven technical understanding of advanced packaging materials, their interactions, failure mechanisms and analytical techniques

Responsibilities

Design silicon and organic interposers for advanced packaging solutions
Experience in EDA tools such as Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition to create and verify advanced package layouts
Perform design studies and what if scenario analysis for advanced packaging schemes to optimize the overall package design.
Create and maintain layout design rules, stack-ups, and layout guidelines
Collaborate with internal and external stakeholders to ensure seamless advanced packaging technology development