Advanced Package and 3DIC Solutions Director

Cadence Design Systems•San Jose, CA

30d

About The Position

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology. This position involves defining and leading the development of advanced packaging and 3DIC implementation flows for foundry and customer solutions. The person that fills this position is expected to develop excellent working relationships with Cadence R&D and product engineering teams as well as customers. Longer term, management responsibilities may be added to this role as our 3DIC services team is staffed up. The candidate is expected to be an expert in Allegro Package Designer (APD, with experience routing laminates and RDL designs, coding technology files, creating rules and constraints, handling Ravel coding for 3D rules, and implementing bondwires, bumps and 3D structures and designs. Experience using Allegro SKILL for scripting and automation a plus. Experience with creating Virtuoso-ready APD package files a must. Expertise in 3rd party packaging formats, including GDS, Gerber, IPC and DXF, both for import and export. RF and standard based (PCIe, LPDDR, UCIE) routing experience a big plus.

Requirements

Bachelor’s degree (Masters preferred) in Electrical or Electronics Engineering
Minimum 20 years experience with package design
10 years experience as an APD expert
Strong knowledge of advanced packaging concepts
Strong knowledge of 2.5D, 3DIC and stacked die technologies
Understanding of chip level CMOS design concepts desired
Good programming knowledge with Allegro Skill and Ravel a plus
Strong customer-facing communication and problem-solving skills
Strong personal drive for continuous learning and expanding professional skill sets
Excellent verbal and written communication skills