Advanced Package and 3DIC Solutions Director

Cadence Systems • San Jose, CA

17d

About The Position

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology. This position involves defining and leading the development of advanced packaging and 3DIC implementation flows for foundry and customer solutions. The person that fills this position is expected to develop excellent working relationships with Cadence R&D and product engineering teams as well as customers. Longer term, management responsibilities may be added to this role as our 3DIC services team is staffed up. The candidate is expected to be an expert in Allegro Package Designer (APD, with experience routing laminates and RDL designs, coding technology files, creating rules and constraints, handling Ravel coding for 3D rules, and implementing bondwires, bumps and 3D structures and designs. Experience using Allegro SKILL for scripting and automation a plus. Experience with creating Virtuoso-ready APD package files a must. Expertise in 3rd party packaging formats, including GDS, Gerber, IPC and DXF, both for import and export. RF and standard based (PCIe, LPDDR, UCIE) routing experience a big plus.

Requirements

• Bachelor’s degree (Masters preferred) in Electrical or Electronics Engineering
• Minimum 20 years experience with package design
• 10 years experience as an APD expert
• Strong knowledge of advanced packaging concepts
• Strong knowledge of 2.5D, 3DIC and stacked die technologies
• Expertise in 3rd party packaging formats, including GDS, Gerber, IPC and DXF, both for import and export.
• Strong customer-facing communication and problem-solving skills
• Strong personal drive for continuous learning and expanding professional skill sets
• Excellent verbal and written communication skills

Nice To Haves

• Understanding of chip level CMOS design concepts desired
• Good programming knowledge with Allegro Skill and Ravel a plus
• RF and standard based (PCIe, LPDDR, UCIE) routing experience a big plus.

Responsibilities

• Defining and leading the development of advanced packaging and 3DIC implementation flows for foundry and customer solutions.
• Developing excellent working relationships with Cadence R&D and product engineering teams as well as customers.
• Routing laminates and RDL designs
• Coding technology files
• Creating rules and constraints
• Handling Ravel coding for 3D rules
• Implementing bondwires, bumps and 3D structures and designs
• Creating Virtuoso-ready APD package files

Benefits

• paid vacation and paid holidays
• 401(k) plan with employer match
• employee stock purchase plan
• a variety of medical, dental and vision plan options

What This Job Offers

• Job Type: Full-time
• Career Level: Director
• Number of Employees: 5,001-10,000 employees