3D Tomography Application Engineer

ZEISS Group•Seoul, CA

2d•$130,000 - $163,000•Onsite

About The Position

How many companies can say they’ve been in business for over 177 years?! Here at ZEISS, we certainly can! As the pioneers of science, ZEISS handles the everchanging environments in a fast-paced world, meeting it with cutting edge of technologies and continuous advancements. ZEISS believes that innovation and technology are the key to a sustainable future and solutions for global change. We have a diverse range of portfolios throughout the ZEISS family in segments like, Industrial Quality & Research, Medical Technology, Consumer Markets and Semiconductor Manufacturing Technology. We are a global company with over 42,000 employees and have over 4,000 in the US and Canada alone! Make a difference, come join the team! What’s the role? ZEISS is seeking a creative engineer or scientist to join its diverse, international team developing metrology and inspection solutions for advanced semiconductor manufacturing. The position focuses on pushing FIB-SEM technology beyond conventional limits to solve complex challenges in 3D metrology and semiconductor device inspection. This role offers daily opportunities to innovate, learn, and contribute to the development of cutting-edge products. Sound Interesting? Here’s what you’ll do: Hands-on development of applications for in-line metrology and inspection in semiconductor manufacturing using ZEISS FIB-SEM technology. Operate FIB-SEM systems in the customer’s clean room environment. Collaborate with the engineering team to drive development and improvement of FIB-SEM technology. Gain first-hand knowledge of semiconductor FIB-SEM applications at customer sites and identify areas for improvement and new market opportunities. Work closely with internal hardware and software development groups. Provide technical guidance to Business Development Managers and the sales team. Lead and perform live customer demonstrations using customer samples and wafers. Permanent work location will be on-site at the customer facility in Fremont, California.

Requirements

Bachelor’s or Master’s degree in Engineering, Materials Science, Physics, or Chemistry.
Experience with SEM imaging and a solid understanding of SEM imaging mechanisms.
Proven ability to develop new processes or methodologies using FIB-SEM or SEM instruments.
Familiarity with Design of Experiments (DOE) and Statistical Process Control (SPC).
Excellent communication skills, self-direction, integrity, a positive attitude, eagerness to learn, and strong teamwork abilities.
Openness to international travel and the ability to work in semiconductor fabs in the USA, South Korea, Taiwan, China, and Japan.

Nice To Haves

Experience with FIB-SEM sample preparation is an advantage.
Knowledge of coding in Python or another language for data analytics or image processing is a strong plus.

Responsibilities

Hands-on development of applications for in-line metrology and inspection in semiconductor manufacturing using ZEISS FIB-SEM technology.
Operate FIB-SEM systems in the customer’s clean room environment.
Collaborate with the engineering team to drive development and improvement of FIB-SEM technology.
Gain first-hand knowledge of semiconductor FIB-SEM applications at customer sites and identify areas for improvement and new market opportunities.
Work closely with internal hardware and software development groups.
Provide technical guidance to Business Development Managers and the sales team.
Lead and perform live customer demonstrations using customer samples and wafers.
Permanent work location will be on-site at the customer facility in Fremont, California.