The Senior Process Engineer, Dry Etch will lead the development and optimization of dry etch processes (ICP, RIE) for compound semiconductor applications. This role involves driving process integration and improvement initiatives to enhance device performance and yield. The engineer will define and control etch process parameters for GaAs and InP substrates, ensuring precision, uniformity, and repeatability. Advanced metrology tools such as SEM, AFM, ellipsometry, profilometry, XPS, XRD, and optical interferometry will be utilized for process characterization and defect analysis. Collaboration with integration, production, and device engineering teams is essential to integrate etch processes into the overall semiconductor fabrication flow. The engineer will troubleshoot process deviations, particle contamination, and chamber performance issues, implementing corrective actions and continuous improvement strategies. Establishing and maintaining Statistical Process Control (SPC) for process monitoring and optimization is also a key responsibility. The role includes evaluating and qualifying new etch chemistries, hardware configurations, and process automation tools, as well as developing and documenting process recipes, work instructions, and standard operating procedures (SOPs). Mentoring junior engineers and providing technical leadership in semiconductor dry etch and metrology is expected.
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Job Type
Full-time
Career Level
Senior
Industry
Computer and Electronic Product Manufacturing
Education Level
Bachelor's degree