Sr. Wafer Fab Engineer

Excelitas Technologies•Billerica, MA

4d•$120,000 - $160,000•Onsite

About The Position

Excelitas is a global technology leader with more than 7,500 employees, focused on delivering market-driven solutions to fulfill the illumination, optical, detection and imaging needs of OEMs and end-users across the biomedical, semiconductor, industrial, consumer products, scientific, security, defense and aerospace sectors. Our facility in Billerica, Massachusetts, specializes in the design and manufacturing of advanced photonics products based on MEMS and other micro-scale optical devices. This site's Optical Coherence Tomography (OCT) products are laser-based imaging tools that have transformed ophthalmic care and made notable impacts on patients in cardiology, dermatology, oncology, gastroenterology, and other medical specialties. We are currently seeking a Sr. Wafer Fab Engineer to support and advance our Wafer Fab R&D Engineering team, with a focus on our silicon-based MEMS fabrication process that enables our core technology: the cavity laser filter. In this role, you will develop deep expertise in our processes and work closely with Manufacturing to drive continuous improvements that increase filter yield and performance. You will also lead our expanding efforts in compound semiconductor fabrication, including developing wet etch processes for GaAs and InP and serving as the primary technical liaison to external foundries that process these materials. In addition, you will take ownership of wafer bonding initiatives by developing a strong understanding of wafer-to-wafer, chip-to-wafer, and chip-to-chip bonding techniques, while identifying, evaluating, and qualifying external partners capable of both prototyping and long-term production support. This position offers a unique opportunity to contribute across silicon MEMS, III-V materials, and advanced packaging domains, with significant impact on both technology development and manufacturing strategy. The position is hands-on and requires a high degree of cross-functional collaboration and teamwork both as a project lead as well as an individual contributor.

Requirements

Minimum BS in Electrical Engineering, Materials Science or a related discipline is required
5+ years industry experience for candidates with BS, 4+ years of industry experience for candidates with MS, 3+ years of industry experience for candidates with PhD is desired.
Experience with various semiconductor process technologies including photolithography, dry etch, wet etch, metal PVD, and PECVD is required; MEMS device fabrication experience is strongly desired.
Experience with wafer bonding techniques with a strong understanding of substrate constraints, thermal budgets, and alignment schema.
Strong working knowledge of various fabrication metrology techniques is required, including optical microscopy, optical & stylus profiling, and SEM.
Self-motivated with the ability to work both independently and in a team environment.
Strong organizational and problem-solving skills are highly desired.
Basic understanding of DOE and SPC concepts is highly desired.

Nice To Haves

Familiarity with Ni electroplating is preferred but not required.

Responsibilities

Develop and support wafer fabrication processes for MEMS, VCSELs, micro-optics, and PICs.
Lead all advanced fabrication R&D projects in our on-site cleanroom.
Work with Manufacturing to identify areas of improvement in the fabrication process to reduce scrap.
Track variation and process capability throughout the value stream, identify and support continuous improvement initiatives.
Support Ni-electroplated microstructure production.
Implement, document, and maintain in-process routings, work instructions, tool trainings, tests & specifications.