Senior Thin Films Engineer

Intel Corporation•Hillsboro, OR

1d•$133,800 - $255,200•Hybrid

About The Position

Manufacturing Development Customer Engineering (MDCE) is Intel's newest organization within Intel Foundry Technology Manufacturing (FTM). We bridge the critical gap between Technology Development (TD) and High-Volume Manufacturing (HVM), advancing technology nodes and process capability from initial product qualification to high-yield production across multiple products while enhancing technologies for our foundry customers. Join Intel's Manufacturing Development and Customer Engineering (MDCE) team as a Senior Engineer driving process innovation across Intel's most advanced semiconductor technologies in volume manufacturing. You will spearhead the development, optimization, and manufacturability of critical thin film deposition processes, ensuring seamless transitions from early development to high-volume production while meeting Intel foundry customer requirements.

Requirements

Results-driven professional with exceptional technical problem-solving abilities.
Proven track record of significant accomplishments across multiple technology nodes.
Strong analytical skills with expertise in yield improvement, performance enhancement, and variation reduction.
Deep understanding of semiconductor manufacturing strategies, fab operations, and technology transfer.
Outstanding communication skills for presenting complex technical information to varied audiences.
Self-motivated with strong initiative and ability to navigate ambiguous technical challenges.
Demonstrated ability to manage multiple high-priority projects under pressure while maintaining quality focus.
Experience driving clarity in complex technical situations and leading cross-functional initiatives.
Comprehensive knowledge of process development, materials science, and device physics.
Ability to interpret industry trends and translate market dynamics into actionable technical strategies.
Experience with foundry business models and customer engagement requirements.
Proven capability to work independently while managing diverse technical assignments.
Master's degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field.
5+ years semiconductor industry experience with strong focus on thin film deposition processes.
Proven experience in process development, technical leadership, and manufacturing engineering.
Extensive background working with equipment suppliers (AMAT, LAM, ASM, TEL) on process optimization.
Comprehensive fab startup experience across manufacturing, quality, RandD, and supply chain functions.
Proficiency with Statistical Process Control (SPC), Design of Experiments (DOE), and factory automation systems.

Nice To Haves

Doctoral degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field with research publications and patent portfolio in thin film technologies.
Expertise in Gate All Around (GAA) logic technologies within semiconductor foundry environments.
Proven track record delivering customized solutions across Technology Development and HVM organizations.
Cross-functional leadership experience managing diverse stakeholder groups.
Semiconductor foundry experience.

Responsibilities

Lead thin film process excellence across CVD, ALD, PVD, epitaxy, thermal/plasma deposition, furnace, implant, anneal, and/or treatment technologies.
Operating at the nexus of Technology Development and High-Volume Manufacturing, you will drive breakthrough solutions for Intel 18A, Intel 3, 12nm, and next-generation technology nodes.
Champion safety, quality, yield, throughput, and cost optimization across thin film deposition modules.
Drive defectivity reduction and uniformity improvements through systematic process enhancement.
Lead technical problem resolution and deliver solutions that meet aggressive technology node targets.
Optimize equipment performance working with internal teams and key suppliers.
Align technical vision with customer requirements and business objectives.
Synthesize complex technical data to formulate and execute strategic responses.
Own end-to-end resolution of manufacturing challenges spanning multiple engineering disciplines.
Deliver rapid execution of innovative solutions to meet challenging development timelines.
Collaborate closely with Technology Development, High Volume Manufacturing, and Business Groups.
Build strong relationships with Integration, Device, Yield, Quality, Reliability teams, and external suppliers.
Present technical findings effectively to diverse audiences from engineering teams to executive leadership.
Foster in-person collaboration to accelerate decision-making and problem resolution.
Stay current with semiconductor industry trends and emerging process technologies.
Drive strategic initiatives that position Intel at the forefront of manufacturing innovation.
Contribute to technology roadmaps through hands-on technical expertise and market insight.